August 26, 2014 Volume 10 Issue 32

Electrical/Electronic News & Products

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Intro to reed switches, magnets, magnetic fields

This brief introductory video on the DigiKey site offers tips for engineers designing with reed switches. Dr. Stephen Day, Ph.D. from Coto Technology gives a solid overview on reed switches -- complete with real-world application examples -- and a detailed explanation of how they react to magnetic fields.
View the video.


Bi-color LEDs to light up your designs

Created with engineers and OEMs in mind, SpectraBright Series SMD RGB and Bi-Color LEDs from Visual Communi-cations Company (VCC) deliver efficiency, design flexibility, and control for devices in a range of industries, including mil-aero, automated guided vehicles, EV charging stations, industrial, telecom, IoT/smart home, and medical. These 50,000-hr bi-color and RGB options save money and space on the HMI, communicating two or three operating modes in a single component.
Learn more.


All about slip rings: How they work and their uses

Rotary Systems has put together a really nice basic primer on slip rings -- electrical collectors that carry a current from a stationary wire into a rotating device. Common uses are for power, proximity switches, strain gauges, video, and Ethernet signal transmission. This introduction also covers how to specify, assembly types, and interface requirements. Rotary Systems also manufactures rotary unions for fluid applications.
Read the overview.


Seifert thermoelectric coolers from AutomationDirect

Automation-Direct has added new high-quality and efficient stainless steel Seifert 340 BTU/H thermoelectric coolers with 120-V and 230-V power options. Thermoelectric coolers from Seifert use the Peltier Effect to create a temperature difference between the internal and ambient heat sinks, making internal air cooler while dissipating heat into the external environment. Fans assist the convective heat transfer from the heat sinks, which are optimized for maximum flow.
Learn more.


EMI shielding honeycomb air vent panel design

Learn from the engineering experts at Parker how honeycomb air vent panels are used to help cool electronics with airflow while maintaining electromagnetic interference (EMI) shielding. Topics include: design features, cell size and thickness, platings and coatings, and a stacked design called OMNI CELL construction. These vents can be incorporated into enclosures where EMI radiation and susceptibility is a concern or where heat dissipation is necessary. Lots of good info.
Read the Parker blog.


What is 3D-MID? Molded parts with integrated electronics from HARTING

3D-MID (three-dimensional mechatronic integrated devices) technology combines electronic and mechanical functionalities into a single, 3D component. It replaces the traditional printed circuit board and opens up many new opportunities. It takes injection-molded parts and uses laser-direct structuring to etch areas of conductor structures, which are filled with a copper plating process to create very precise electronic circuits. HARTING, the technology's developer, says it's "Like a PCB, but 3D." Tons of possibilities.
View the video.


Loss-free conversion of 3D/CAD data

CT CoreTech-nologie has further developed its state-of-the-art CAD converter 3D_Evolution and is now introducing native interfaces for reading Solidedge and writing Nx and Solidworks files. It supports a wide range of formats such as Catia, Nx, Creo, Solidworks, Solidedge, Inventor, Step, and Jt, facilitating smooth interoperability between different systems and collaboration for engineers and designers in development environments with different CAD systems.
Learn more.


Top 5 reasons for solder joint failure

Solder joint reliability is often a pain point in the design of an electronic system. According to Tyler Ferris at ANSYS, a wide variety of factors affect joint reliability, and any one of them can drastically reduce joint lifetime. Properly identifying and mitigating potential causes during the design and manufacturing process can prevent costly and difficult-to-solve problems later in a product lifecycle.
Read this informative ANSYS blog.


Advanced overtemp detection for EV battery packs

Littelfuse has introduced TTape, a ground-breaking over-temperature detection platform designed to transform the management of Li-ion battery systems. TTape helps vehicle systems monitor and manage premature cell aging effectively while reducing the risks associated with thermal runaway incidents. This solution is ideally suited for a wide range of applications, including automotive EV/HEVs, commercial vehicles, and energy storage systems.
Learn more.


Benchtop ionizer for hands-free static elimination

EXAIR's Varistat Benchtop Ionizer is the latest solution for neutralizing static on charged surfaces in industrial settings. Using ionizing technology, the Varistat provides a hands-free solution that requires no compressed air. Easily mounted on benchtops or machines, it is manually adjustable and perfect for processes needing comprehensive coverage such as part assembly, web cleaning, printing, and more.
Learn more.


LED light bars from AutomationDirect

Automation-Direct adds CCEA TRACK-ALPHA-PRO series LED light bars to expand their offering of industrial LED fixtures. Their rugged industrial-grade anodized aluminum construction makes TRACKALPHA-PRO ideal for use with medium to large-size industrial machine tools and for use in wet environments. These 120 VAC-rated, high-power LED lights provide intense, uniform lighting, with up to a 4,600-lumen output (100 lumens per watt). They come with a standard bracket mount that allows for angle adjustments. Optional TACLIP mounts (sold separately) provide for extra sturdy, vibration-resistant installations.
Learn more.


World's first metalens fisheye camera

2Pi Optics has begun commercial-ization of the first fisheye camera based on the company's proprietary metalens technology -- a breakthrough for electronics design engineers and product managers striving to miniaturize the tiny digital cameras used in advanced driver-assistance systems (ADAS), AR/VR, UAVs, robotics, and other industrial applications. This camera can operate at different wavelengths -- from visible, to near IR, to longer IR -- and is claimed to "outperform conventional refractive, wide-FOV optics in all areas: size, weight, performance, and cost."
Learn more.


Orbex offers two fiber optic rotary joint solutions

Orbex Group announces its 700 Series of fiber optic rotary joint (FORJ) assemblies, supporting either single or multi-mode operation ideal for high-speed digital transmission over long distances. Wavelengths available are 1,310 or 1,550 nm. Applications include marine cable reels, wind turbines, robotics, and high-def video transmission. Both options feature an outer diameter of 7 mm for installation in tight spaces. Construction includes a stainless steel housing.
Learn more.


Mini tunnel magneto-resistance effect sensors

Littelfuse has released its highly anticipated 54100 and 54140 mini Tunnel Magneto-Resistance (TMR) effect sensors, offering unmatched sensitivity and power efficiency. The key differentiator is their remarkable sensitivity and 100x improvement in power efficiency compared to Hall Effect sensors. They are well suited for applications in position and limit sensing, RPM measurement, brushless DC motor commutation, and more in various markets including appliances, home and building automation, and the industrial sectors.
Learn more.


Panasonic solar and EV components available from Newark

Newark has added Panasonic Industry's solar inverters and EV charging system components to their power portfolio. These best-in-class products help designers meet the growing global demand for sustainable and renewable energy mobility systems. Offerings include film capacitors, power inductors, anti-surge thick film chip resistors, graphite thermal interface materials, power relays, capacitors, and wireless modules.
Learn more.


5 billion transistors and counting: DARPA SyNAPSE program develops advanced brain-inspired chip

DARPA-funded researchers have developed one of the world's largest and most complex computer chips ever produced -- one whose architecture is inspired by the neuronal structure of the brain and requires only a fraction of the electrical power of conventional chips. DARPA is the Defense Advanced Research Projects Agency.

Designed by researchers at IBM in San Jose, CA, under DARPA's Systems of Neuromorphic Adaptive Plastic Scalable Electronics (SyNAPSE) program, the chip is loaded with more than 5 billion transistors and boasts more than 250 million "synapses," or programmable logic points, analogous to the connections between neurons in the brain.

That's still orders of magnitude fewer than the number of actual synapses in the brain, but a giant step toward making ultra-high-performance, low-power neuro-inspired systems a reality.

Many tasks that people and animals perform effortlessly, such as perception and pattern recognition, audio processing, and motor control are difficult for traditional computing architectures to do without consuming a lot of power. Biological systems consume much less energy than current computers attempting the same tasks. The SyNAPSE program was created to speed the development of a brain-inspired chip that could perform difficult perception and control tasks while at the same time achieving significant energy savings.

The SyNAPSE-developed chip, which can be tiled to create large arrays, has 1 million electronic "neurons" and 256 million electronic synapses between neurons. Built on Samsung Foundry's 28-nm process technology, the 5.4-billion transistor chip has one of the highest transistor counts of any chip ever produced. Each chip consumes less than 100 mW of electrical power during operation. When applied to benchmark tasks of pattern recognition, the new chip achieved two orders of magnitude in energy savings compared to state-of-the-art traditional computing systems.

The high energy efficiency is achieved, in part, by distributing data and computation across the chip, alleviating the need to move data over large distances. In addition, the chip runs in an asynchronous manner, processing and transmitting data only as required, similar to how the brain works. The new chip's high energy efficiency makes it a candidate for defense applications such as mobile robots and remote sensors where electrical power is limited.

"Computer chip design is driven by a desire to achieve the highest performance at the lowest cost," says Gill Pratt, DARPA program manager. "Historically, the most important cost was that of the computer chip. But Moore's law -- the exponentially decreasing cost of constructing high-transistor-count chips -- now allows computer architects to borrow an idea from nature, where energy is a more important cost than complexity, and focus on designs that gain power efficiency by sparsely employing a very large number of components to minimize the movement of data. IBM's chip, which is by far the largest one yet made that exploits these ideas, could give unmanned aircraft or robotic ground systems with limited power budgets a more refined perception of the environment, distinguishing threats more accurately and reducing the burden on system operators."

"Our troops often are in austere environments and must carry heavy batteries to power mobile devices, sensors, radios, and other electronic equipment. Air vehicles also have very limited power budgets because of the impact of weight," says Pratt. "For both of these environments, the extreme energy efficiency achieved by the SyNAPSE program's accomplishments could enable a much wider range of portable computing applications for defense."

Another potential application for the SyNAPSE-developed chip is neuroscience modeling. The large number of electronic neurons and synapses in each chip and the ability to tile multiple chips could lead to the development of complex, networked neuromorphic simulators for testing network models in neurobiology and deepening current understanding of brain function.

A technical paper on the new chip is available here.

Source: DARPA

Published August 2014

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